TSV Filling Technology using Cu Electrodeposition
نویسندگان
چکیده
منابع مشابه
Architectural Growth of Cu Nanoparticles Through Electrodeposition
Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nan...
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www.pharmtech.com he number of parenteral products entering development and reaching the market has increased significantly during the past decade. By some estimates as many as half of all investigational new drug applications consist of biopharmaceuticals, the vast majority of which are manufactured aseptically. Most of these products are proteins and therefore highly susceptible to microbial ...
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The electrochemical deposition of Cu into 0.12 cm and 60 μm thick, highly porous 65 vol % Ni/yttriastabilized zirconia (YSZ) cermets was investigated. An electrochemical cell in which the electrolyte solution was allowed to flow through a porous Ni/YSZ substrate was used to eliminate mass-transfer limitations and to determine the conditions for which the potential drop in the electrolyte soluti...
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Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surfacecapping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nano...
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Cu-Zn alloys have been electrodeposited from a pyrophosphate electrolyte containing Cu2P207> Zn2P207 salts and an excess of K4P2O7 and KN03. Current-potential data for both copper and zinc, as well their plating current efficiencies were determined from electrochemical polarisation experiments. Copper deposition commenced at potentials below -0.208 V whereas zinc was deposited only below -1.157...
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ژورنال
عنوان ژورنال: Journal of Welding and Joining
سال: 2014
ISSN: 2466-2232
DOI: 10.5781/jwj.2014.32.3.11